Plasma/Thermal ALD equipment 'Fiji G2'
500℃ wafer stage! Adoption of a remote ICP source with no plasma damage.
The "Fiji G2" is a research and development ALD system that utilizes thermal and plasma methods. It employs an ICP remote plasma source and features a vacuum load lock for substrate transport, designed to produce high-quality ALD films of oxide, nitride, and metal layers. Additionally, it comes standard with a simple exhaust unit, the ALD Shield Vapor Trap, and can accommodate up to 6 plasma gas lines. 【Features】 ■ 500°C wafer stage ■ Remote ICP source with no plasma damage ■ Mode supporting ultra-high aspect ratios (<2000:1) (thermal) ■ Plasma gas lines: up to 6 lines ■ Precursor lines: up to 6 lines *For more details, please refer to the PDF document or feel free to contact us.
- Company：ハイテック・システムズ
- Price：Other
